发明名称 SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treating method and a substrate treating device allowing efficient substrate treatment and monitoring. SOLUTION: Voltage is applied from a high voltage power supply 40 to a gap between a substrate 34 and a facing electrode 38 that are disposed facingly in vacuum atmosphere, thereby releasing micro particles on the substrate toward the facing electrode. A plurality of photodetectors 42 detect light emission caused by the micro particles released from the substrate, thereby conditioning and monitoring the substrate. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003303545(A) 申请公布日期 2003.10.24
申请号 JP20020106664 申请日期 2002.04.09
申请人 TOSHIBA CORP 发明人 IZEKI YASUSHI;KUWABARA YUJI;MURATA HIROTAKA
分类号 H01J9/42;H01J9/38;(IPC1-7):H01J9/42 主分类号 H01J9/42
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