| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable semiconductor device where no secular variation is observed in resistance between a wire and a pad electrode for stable operation for an extended period. <P>SOLUTION: An internal electrode layer 4, a barrier metal layer 5, and an external electrode layer 9 are sequentially laminated, from a semiconductor substrate 1 side on the main surface of the semiconductor substrate 1, to form a pad electrode 8 to which a wire 7 is electrically connected. The area of the external electrode layer 9 of the pad electrode 8 is set halfway between an overlapped area of the wire 7 on the pad electrode 8 and a planar area of the barrier metal layer 5. <P>COPYRIGHT: (C)2004,JPO |
