| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board device for information equipment the circuit board of which is not required to be designed and manufactured from scratch for every specification. SOLUTION: A multilayered module substrate 300 mounted with a plurality of high-frequency electronic components, such as a CPU 301, a graphic circuit 304, etc., is mounted on one surface of a base substrate 200 mounted with a plurality of low-frequency electronic components. The module substrate 300 has a smaller square shape than the base substrate 200 has. The electronic components are wired through the wiring pattern of an internal layer. Connector terminals 310 are respectively soldered to the four sides of the module substrate 300, and the substrate 300 is mounted on the base substrate 200 through the terminals 310. COPYRIGHT: (C)2004,JPO
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