发明名称 SUBSTRATE INSPECTION METHOD AND SUBSTRATE INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate inspection method capable of inspecting the existence or absence of a disconnection in a conductive pattern at a low cost in a short time. SOLUTION: In this substrate inspection method, the existence of a disconnection in a plurality of conductive patterns 21a-21c formed on an inspection object substrate P is inspected electrically. In the method, probes 3a-3c are brought into contact with lands 22b of the conductive patterns 21a-21c, and electron beams EL are emitted in vacuum toward the lands 22b of the conductive patterns 21a-21c, and currents flowing in the conductive patterns 21a-21c by emission of the electron beams EL are measured through the probes 3a-3c, to thereby inspect the existence or absence of the disconnection in the conductive patterns 21a-21c based on the measured values. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003302437(A) 申请公布日期 2003.10.24
申请号 JP20020107489 申请日期 2002.04.10
申请人 HIOKI EE CORP 发明人 TOMOI TADASHI
分类号 G01R31/02;(IPC1-7):G01R31/02 主分类号 G01R31/02
代理机构 代理人
主权项
地址