| 摘要 |
<P>PROBLEM TO BE SOLVED: To quickly deal with a case where a mounting inspection system recognizes that no chip component is present on the solder after the chip component is mounted on the solder provided on a board. <P>SOLUTION: In a packaging system where a chip component is mounted, by a small component mounter 12, on the paste solder provided on the board and the mounting state is inspected by a mounting inspection system 13, a decision is made at first whether the mounting flaw of the chip component is present on the solder or not when the mounting inspection system 13 confirmed absence of the chip component, and then the mounting nozzle 452 used for mounting the missed chip component is specified. Subsequently, the decision results are transmitted to the controller 41 of the small component mounter 12 and the controller 41 acquires information for dealing with the situation from a database 431 and displays it on a display 451. <P>COPYRIGHT: (C)2004,JPO |
