| 摘要 |
PROBLEM TO BE SOLVED: To reduce the manufacturing man-hours of a multilayered thick-film wiring board by curtailing used insulating layer materials and simultaneously forming a ground layer and a power-supply layer, at the time of manufacturing the wiring board by a pattern printing method using a mask. SOLUTION: The ground layer and the power-supply layer of the multilayered thick-film wiring board are provided in a meshed comb-teeth form in the same layer formed on the surface of a base substrate by insulating and isolating the layered from each other. In addition, the widths W of the conductors of the ground and power- supply layers are adjusted to become≥L2+α×2, wherein L2 denotes the diameter of the junction between a via hole and the conductor of the ground or power-supply layer, andαis the tolerance of printing displacement. Alternatively, the ground and the power-supply layers are provided in the meshed comb-teeth form in the same layer held between insulating layers other those formed on the surface of the base substrate by insulating and isolating the layers from each other, and the widths W of the conductors of the layers are adjusted to become≥L1+2G+2D, wherein L1, G, and D respectively denote the diameter of a via hole made through the ground and power-supply layers in an insulated and isolated state, the width of an insulator, and the minimum width of the conductors. COPYRIGHT: (C)2004,JPO |
