| 摘要 |
PROBLEM TO BE SOLVED: To provide a communication package which will not be affected by hydrogen gas, and to provide a method for manufacturing the same. SOLUTION: In the method for manufacturing a communications package, a 1-60 minute of heat treatment is carried out at 500-780°C, before finishing by plating, in vacuum or in a hydrogen or inert gas atmosphere for the desporption of adsorbed hydrogen, and as necessary, another heat treatment is carried out, this one after the completion of plating, for 2 hours or longer at 210-450°C, again in vacuum or in a hydrogen or in an inert gas atmosphere. After these heat treatments, the communications package emits only 1E-10 g/sec or less of H<SB>2</SB>gas, even if it is heated to 300°C or higher during module mounting, and for a cap-sealed communications package, emission of residual H<SB>2</SB>gas accounts for but 0.02% or lower in a time period of 100 hours of heating at 250°C. COPYRIGHT: (C)2004,JPO
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