| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method for a wire which can form the wire of high quality by a simple method while suppressing an increase in the number of manufacturing processes. SOLUTION: The method for forming the wire comprises steps for: (a) forming an etching-preventive film on a substrate where a lower-layer wire is formed; (b) forming an inter-layer insulating film on the substrate; (c) forming a connection hole in the inter-layer insulating film; (d) forming a non- photosensitive organic material film on the inter-layer insulating film including the connection hole; (e) removing the organic material film on the inter-layer insulating film while leaving the organic material film in the connection hole; (f) forming a resist pattern which has an opening in the area including the connection hole; (g) forming a wire groove by patterning the inter-layer insulating film by using the resist pattern as a mask; (h) removing the resist pattern, organic material film, and etching-preventive film; and (i) forming an upper-layer wire reaching the lower-layer wire by filling the connection hole and wire groove with a conductive film. COPYRIGHT: (C)2004,JPO
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