发明名称 SOCKET FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a socket capable of surely and simply connecting and simply detaching an electronic component with a lead wire to and from the wiring of a testing device or the like. SOLUTION: The socket for the electronic component with a lead wire made of shape-memory alloy comprises a connection part which get into a state of being connected to the lead wire of the electronic component, when the crystal structure of the shape-memory alloy is in a state of austenite phase, and a disconnection means which turns the lead wire of the electronic component into a state of not being connected with the connection part by deforming the shape of the shape-memory alloy into such a level that the structure can not be restored into original state by elastic force, when the crystal structure of the shape-memory alloy is in a state of martensite phase. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003303652(A) 申请公布日期 2003.10.24
申请号 JP20020106654 申请日期 2002.04.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 SHIGYO KAZUHIRO;UMEMURA SONOKO;KINUGAWA MASARU
分类号 G01R31/26;G01R1/073;H01R13/03;H01R33/72;(IPC1-7):H01R33/72 主分类号 G01R31/26
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