| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component with external metal terminals which uses high-temperature lead-free solder and has superior mechanism strength such as tensile strength and a load withstanding property and also has superior resistance to reflow. SOLUTION: The electronic component with external metal terminals has such a structure that edge electrodes 11 and 12 of a ceramic capacitor element 1 which is a body of the electronic component, and the external metal terminals 2 and 3 are electrically bonded via solder layers 4 and 5. When bonding the edge electrodes 11 and 12 of the ceramic capacitor element 1 and the external metal terminals 2 and 3, Cu, which is conductive components of the edge electrodes 11 and 12 is diffused into the solder layers 4 and 5, forming Cu diffusion layers in solder bonding sections. For the solder layers 4 and 5, the high- temperature lead-free solder is used which has a metal composition of Sn/Sb=70/30 to 90/10 in terms of a wt.% ratio. COPYRIGHT: (C)2004,JPO
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