SYSTEM FOR BONDING SUBSTRATE FOR FLAT PANEL

摘要

PROBLEM TO BE SOLVED: To crush both substrates down to a prescribed gap by a uniform pressurization distribution while simplifying their structure. SOLUTION: An electrode section 3a2 is fitted into a hollow groove section 3b1 of the surface of a supporting substrate 3b and the surface of the supporting substrate 3b and the surface of the electrode section 3a2 are smoothed, by which even a substrate contact surface 3a' on a dielectric film 3a1 laminated thereon is smoothed without the occurrence of ruggedness like a difference in level. COPYRIGHT: (C)2004,JPO