| 摘要 |
The invention relates to a method for connecting substrates (202, 212) comprising electric, semiconductive, mechanical and/or optical components, in addition to a composite element. The method should be substantially material-independent with regard to the substrates to be connected and in addition be suitable for delicate substrates in particular, whilst at the same time exhibiting a high chemical and physical stability and/or creating a hermetic cavity. According to the invention, a raised frame (210a, 210b, 210c, 210d), in particular consisting of an anodically bondable glass, is deposited by vaporisation on one of the two substrates, in order to act as a connecting element. |
