| 摘要 |
<p>A semiconductor device comprising a semiconductor element rendered thin, in which reliability can be ensured by protecting the semiconductor element against damage in the vicinity of the outer edge part. A plurality of external connection terminals are formed on the front surface of the semiconductor element and a plate having higher rigidity than that of the semiconductor element is bonded to the rear surface of the semiconductor element rendered thin through resin, in a semiconductor device. Contour of the plate is made larger than that of the semiconductor element and the side face of the semiconductor element is covered with resin, thus forming a part for reinforcing the edge part of the semiconductor element.</p> |
