| 发明名称 |
Systems and methods for bonding a heat sink to a printed circuit assembly |
| 摘要 |
A bonding system is provided that bonds a heat sink to a printed circuit assembly. The bonding system includes an adhesive applicator that is configured to hold an adhesive layer, and a heat sink holder that is configured to hold a heat sink while the adhesive applicator applies the adhesive layer to the heat sink.
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| 申请公布号 |
US2003196751(A1) |
申请公布日期 |
2003.10.23 |
| 申请号 |
US20020124544 |
申请日期 |
2002.04.17 |
| 申请人 |
HUSEBY WILLIAM R.;BARKER JOHN;GROSHONG JOSEPH |
发明人 |
HUSEBY WILLIAM R.;BARKER JOHN;GROSHONG JOSEPH |
| 分类号 |
B32B37/12;H05K3/00;H05K3/38;(IPC1-7):B32B31/00 |
主分类号 |
B32B37/12 |
| 代理机构 |
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