| 摘要 |
A process for attaching one or more optoelectronic components to an optical submount uses an epoxy to first tack each component to its associated bondpad site. The epoxy has a sufficient strength to temporarily hold each component in place as various ones of the components are positioned, moved, etc. Once all of the components are "tacked" into position, the arrangement is heated to the solder reflow temperature, where the molten solder will displace the epoxy and form the final physical and electrical connection between the components and the submount. Preferably, the solder reflow temperature is sufficient to cure the epoxy, which then forms an inert substance that will not interfere with the performance of the final system.
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