发明名称 |
Integrated circuit device packaging structure and packaging method |
摘要 |
A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.
|
申请公布号 |
US2003197258(A1) |
申请公布日期 |
2003.10.23 |
申请号 |
US20030418204 |
申请日期 |
2003.04.18 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SHIRAKAWA YASUFUMI;TANIGUCHI MASAKI;FUKUDA HIDEO;SHIMIZU YUZO;ESAKI SHINYA |
分类号 |
H01L31/02;G11B7/24;G11B7/26;H01L21/00;H01L23/02;H01L23/28;H01L25/16;H01L27/14;H01L27/15;H01L31/00;H01L31/0203;H01L31/0232;H01L31/12;H01L33/00;(IPC1-7):H01L23/02 |
主分类号 |
H01L31/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|