Flip-chip package containing a chip and a substrate having differing pitches for electrical connections

摘要

A flip-chip package uses a substrate having bond pad spacing that matches terminal spacing on a chip at an elevated temperature, such as the temperature of the chip during bonding to the substrate, the melting point of solder used on the chip, a temperature within the range of thermal cycling of the chip, or an operating temperature of the chip. Matching spacing at an elevated temperature permits a better alignment at the bonding temperature for formation of stronger bonds.