发明名称 MOISTURE AND HEAT ISOLATING FLOORBOARD
摘要 <p>The present invention refers to a moisture and heat isolating floorboard which comprises a top layer that is composed of more than one thin sheet which are pressed and adhered together, a core layer that is composed of more than one pant fiber sheet which are adhered and pressed together and a base layer that is composed of more than one thin sheet. The top layer, core layer and base layer are adhered and pressed together from the floorboard. The material of the core layer is selected from the following group: wood fiber, bamboo fiber, straw fiber, rice straw fiber, rice husk fiber, fruit husk fiber, corn straw fiber, sunflower straw fiber, sugarcane fiber, jute fiber, cotton straw fiber etc.</p>
申请公布号 WO2003087496(P1) 申请公布日期 2003.10.23
申请号 CN2002000670 申请日期 2002.09.20
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