| 摘要 |
At first, a sprocket hole (12) and a device hole (14) are made in a flexible tape-like transparent or translucent insulating base (11). A conductor is then laminated on the surface of the insulating base to form a conductive layer. Subsequently, a desired part of the conductive layer is etched to form a wiring pattern (13) and an alignment mark (15). Thereafter, a solder resist layer (16) is formed on portions except the terminal part of the wiring pattern and the alignment mark. Finally, a layer (17) having a transparent or translucent surface is formed on the insulating base around the alignment mark so that the light transmits the front and rear surfaces of the circuit board and the position of the alignment mark can be confirmed. |
