INTERCONNECTION DEVICE FOR ACOUSTIC WAVE INTERFACE COMPONENTS

摘要

The invention relates to the production of acoustic wave interface components comprising two substrates separated by an interface area including transduction devices. Said invention concerns an interconnection device located on the lateral surfaces common to the two substrates and the interface area making up the component. The interconnections are connected to the transduction devices by means of jointing areas leading to the lateral surfaces. Said device makes it possible to limit and simplify the operations of the production method and to minimize the spatial requirements of the device. The invention also relates to a method for producing said component from the transduction electrode deposition phase to the creation of electric interconnections and to a collective method enabling several components to be produced from a single substrate.