BOARD-LEVEL EMI SHIELD WITH ENHANCED THERMAL DISSIPATION

摘要

A substrate (10) having at least one electrical component (11) disposed thereon; a plurality of discrete electrically conductive fastening units (14 ) disposed in a pattern on the substrate surrounding the at least one electric al component; a board-level electromagnetic interference (EMI) shield (20) comprising an electrically conductive layer (26); a plurality of apertures (23) formed in the board-level EMI shield (20) such that the apertures (23) correspond to the pattern of the electrically conductive fastening units (14 ); with at least one thermally conductive interface (TCI) material (40) dispose d over the at least one electrical component; and wherein the electrically conductive layer (26) of the board-level EMI shield is in electrical contact with at least one electrically conductive fastening unit (14).