| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy for an electronic material having satisfactory solderability and plating properties and moreover excellent in stress relaxing characteristics in a Cu-Ni-Si series alloy having sufficient strength and electrical conductivity. SOLUTION: This copper alloy for an electronic material excellent in strength, electrical conductivity and surface characteristics has a composition containing, by mass, 1.5 to 4.0% Ni, 0.30 to 1.2% Si and 0.05 to 0.20% Mg, in which the weight ratio of Ni/Si is also controlled to 3 to 7, and the weight ratio of Si/Mg is controlled to <=8.0, and the balance Cu with inevitable impurities, and also, the ratio of the Mg peak strength/the Si peak strength of the Auger electron spectrum in the outermost surface of the material after final heat treatment is >1.0.
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