Polykristallines Diamantwerkzeug

摘要

A diamond sintered compact cutting tool comprising a diamond sintered compact sintered at an ultra-high pressure and high temperature and a WC-Co type cemented carbide substrate directly bonded to the diamond sintered compact during a step of sintering and brazed to a tool base through the WC-Co type cemented carbide substrate, wherein the ratio of the thickness of the WC-Co type cemented carbide substrate to the thickness of the diamond sintered compact layer satisfies the relationship: 0.8≤WC-Co type cemented carbide substrate/diamond sintered compact layer≤3.0 and wherein the diamond sintered compact layer has a thickness of 0.05 mm to 0.5 mm, preferably 0.05 mm to 0.45 mm.