POLISHING DEVICE AND SUBSTRATE PROCESSING DEVICE

摘要

A polishing device, comprising a plurality of polishing units (30A to 30D), the polishing units further comprising moving mechanisms for moving top rings (301A to 301D) between a polishing position on a polishing surface and a wafer delivery position, linear transporters (5, 6) for transporting wafers between a plurality of transporting positions (TP1 to TP7) including the wafer delivery position, and pushers (33, 34, 37, 38) for delivering the wafers between the linear transporters (5, 6) and the top rings (301A to 301D) installed at the transporting positions (TP2, TP3, TP6, TP7) where the wafers are delivered.