发明名称 |
Temperature control mechanism and temperature control method for disk molding die |
摘要 |
In an injection molding apparatus 62 on which a disk molding die is mounted, wherein the disk molding die is comprised of a stationary die 10 and a movable die 20, a plurality of principal parts of which are separately temperature controlled by media, a control device 50 of the injection molding apparatus 62 is provided with a temperature control mechanism for controlling temperatures of the media which are pumped by a plurality of temperature control devices 51a and 51b in order to control the temperatures of said principal parts.
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申请公布号 |
US2003197294(A1) |
申请公布日期 |
2003.10.23 |
申请号 |
US20030419144 |
申请日期 |
2003.04.21 |
申请人 |
KABUSHIKI KAISHA MEIKI SEISAKUSHO |
发明人 |
SHIRAI HIDEAKI;FUKUMOTO KENJI |
分类号 |
B29C45/26;B29C45/73;B29C45/78;B29D17/00;(IPC1-7):B29C45/73 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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