| 摘要 |
<p>The device is used for layered circuits produced on substrates. Springy contact arms mounted on a substrate holder project into the area surrounded by the framelike outline of the holder. A top and bottom insulating frames (1) are held together by pins inserted in holes. Contact arms (6) are produced by etching from a metal sheet. They are clamped in the overlapping zone of the insulating frames (1, 2), together with metal supports (8) separated from the contact arms (6) by narrow striplike slots (7). They are positioned by a number of pins inserted into holes in the frame. Removable metal edge strip ( 9) outside the insulating frames (1, 2) connects the metal supports (8) and contact arms.</p> |
