发明名称 |
Thin film structure sputter mask - with thin structuring mask and receding thick supporting mask |
摘要 |
<p>A mask to produce electronic modules by a plane sputtering process, consists of a first thin structuring mask which defines the contours of the desired structure. The slope of the second thicker mask which has a supporting purpose is kept to a distance from the slope of the first, which governs by its ratio to the thickness of the second mask the slope of the edges of the stucture. This arrangement provides a fine control of the slope of the edges of thin-film structures, e.g. a flat slope with a rounded top corner and a plane top surface.</p> |
申请公布号 |
DE2739058(A1) |
申请公布日期 |
1979.03.15 |
申请号 |
DE19772739058 |
申请日期 |
1977.08.30 |
申请人 |
SIEMENS AG |
发明人 |
PICHLER,ALFRED;BERGHOF,WINFRIED,DR.RER.NAT.;FLOEGEL,LOTHAR,DIPL.-CHEM.DR.;MITTERHUMMER,GERHARD,DIPL.-ING. |
分类号 |
C23C14/04;G03F1/20;H01L21/68;H05K3/14;(IPC1-7):C23C15/00 |
主分类号 |
C23C14/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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