发明名称 |
Semiconductor integrated circuit device with connections formed using a conductor embedded in a contact hole |
摘要 |
The metal layers embedded into the contact holes of various kinds in shape are used as the lines and are employed as the lines for controlling the substrate bias. The first-layer metal line layers are made thin so as to be also employed as the lines for controlling the substrate bias. Moreover, the second-layer metal line layers are employed as the copper line layers. Thereby, a semiconductor integrated circuit which allows a high-speed and low-power operation is provided with a small area and without increasing the number of the masks.
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申请公布号 |
US2003197213(A1) |
申请公布日期 |
2003.10.23 |
申请号 |
US20030442156 |
申请日期 |
2003.05.21 |
申请人 |
HITACHI, LTD. |
发明人 |
ISHIBASHI KOICHIRO;IKEDA SHUJI;WAKIMOTO HARUMI;KURODA KENICHI |
分类号 |
H01L21/822;H01L21/8238;H01L27/04;H01L27/092;H01L29/00;(IPC1-7):H01L27/108;H01L29/76;H01L29/94;H01L31/119 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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