发明名称 |
High density substrate for the packaging of integrated circuits |
摘要 |
A package for mounting an integrated circuit die. In one embodiment the package comprises a metal substrate having first and second primary opposed surfaces and an aperture formed therebetween. A flexible thin film interconnect structure having bottom and top opposing surfaces is formed over the first primary surface of the metal substrate and over the aperture such that a first region of the bottom surface is in direct contact with the first surface of the metal substrate and a second region of the bottom surface is opposite the aperture. Within the second region of the bottom surface are a first plurality of exposed bonding pads having a first pitch appropriate for attaching the integrated circuit die to package. The top surface of the flexible thin film interconnect structure includes a second plurality of exposed bonding pads having a pitch greater than the first pitch. |
申请公布号 |
US2003197285(A1) |
申请公布日期 |
2003.10.23 |
申请号 |
US20020128813 |
申请日期 |
2002.04.23 |
申请人 |
KULICKE & SOFFA INVESTMENTS, INC. |
发明人 |
STRANDBERG JAN I.;TREVINO RICHARD SCOTT;BLOUNT THOMAS B. |
分类号 |
H01L23/31;H01L23/36;H01L23/433;H01L23/498;(IPC1-7):H01L23/053;H01L23/12;H01L23/34;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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