| 摘要 |
The invention, in a specific embodiment, relates to a method and to a device for treating substrates (29) in printed circuit industry by means of a liquid. The invention is characterized in that the substrates (29), on their surface, are provided with a layer that is partially removed under the influence of the liquid while a pattern is formed. A plurality of nozzles (24) are provided for discharging the liquid and are linked with at least one liquid connection (12). Said liquid connection (12) is linked with a liquid reservoir and can be opened and closed. A valve (17) is provided directly on every nozzle (24), said valves (17) being individually controlled to open and close. The objects (29) are displaced along a track of movement (B) relative to the nozzles (24). A specific amount of liquid is discharged by opening and closing the valves (17) or the liquid connections (12) and has a certain distribution across the surface (26). |
