发明名称 |
Use of fluoropolymer coating for planarizing and passivating integrated circuit devices |
摘要 |
A touch-sensitive semiconductor chip having a physical interface to the environment, where the surface of the physical interface is coated with a fluorocarbon polymer. The polymer is highly scratch resistant and has a characteristic low dielectric constant for providing a low attenuation to electric fields. The polymer can be used instead of conventional passivation layers, thereby allowing a thin, low dielectric constant layer between the object touching the physical interface, and the capacitive sensing circuits underlying the polymer.
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申请公布号 |
US2003199147(A1) |
申请公布日期 |
2003.10.23 |
申请号 |
US20030456649 |
申请日期 |
2003.06.06 |
申请人 |
SIEGEL HARRY M.;LANE FRED P. |
发明人 |
SIEGEL HARRY M.;LANE FRED P. |
分类号 |
H01L21/312;H01L21/20;H01L21/302;H01L21/31;H01L21/44;H01L21/461;H01L21/469;H01L21/768;(IPC1-7):H01L21/469 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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