发明名称 Use of fluoropolymer coating for planarizing and passivating integrated circuit devices
摘要 A touch-sensitive semiconductor chip having a physical interface to the environment, where the surface of the physical interface is coated with a fluorocarbon polymer. The polymer is highly scratch resistant and has a characteristic low dielectric constant for providing a low attenuation to electric fields. The polymer can be used instead of conventional passivation layers, thereby allowing a thin, low dielectric constant layer between the object touching the physical interface, and the capacitive sensing circuits underlying the polymer.
申请公布号 US2003199147(A1) 申请公布日期 2003.10.23
申请号 US20030456649 申请日期 2003.06.06
申请人 SIEGEL HARRY M.;LANE FRED P. 发明人 SIEGEL HARRY M.;LANE FRED P.
分类号 H01L21/312;H01L21/20;H01L21/302;H01L21/31;H01L21/44;H01L21/461;H01L21/469;H01L21/768;(IPC1-7):H01L21/469 主分类号 H01L21/312
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