发明名称 |
Method for making a multi-die chip |
摘要 |
The present invention generally relates to a die perimeter region of a die having a microelectromechanical assembly fabricated thereon. This die perimeter region may be configured to facilitate electrically interconnecting adjacent die on a wafer. Moreover, this die perimeter region may be configured to facilitate separating the die from a wafer.
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申请公布号 |
US2003197248(A1) |
申请公布日期 |
2003.10.23 |
申请号 |
US20030456319 |
申请日期 |
2003.06.06 |
申请人 |
SNIEGOWSKI JEFFRY JOSEPH;RODGERS MURRAY STEVEN |
发明人 |
SNIEGOWSKI JEFFRY JOSEPH;RODGERS MURRAY STEVEN |
分类号 |
B81B7/04;H01L29/06;(IPC1-7):H01L29/06 |
主分类号 |
B81B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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