METHOD FOR FABRICATING TAPE BALL GRID ARRAY SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for fabricating a tape ball grid array(TBGA) semiconductor package is provided to stably settle a solder ball in a via hole formed in a ground plane by increasing cohesion between solder paste and the solder ball. CONSTITUTION: Tape automated bonding(TAB) tape(202) is formed which includes a via hole(203) that opens a ball land region to a heat spreader. A holder that holds the first solder ball(204) having a diameter smaller than or the same as that of the via hole by a vacuum absorption method is mounted on a portion corresponding to the via hole in a direction over the TAB tape. The vacuum inside the holder is eliminated to drop and attach the first solder ball to the via hole. The via hole including the first solder ball is cleaned. The second solder ball having a diameter larger than that of the first solder ball is attached to the via hole including the first solder ball.