| 摘要 |
The substrate ( 2 ) containing the via-hole ( 3 ) is inserted into an electrophoretic cell ( 1 ) and an electrode ( 6 ) (the "first electrode") is placed on top of a first orifice of the via-hole(s) ( 3 ), to be implemented with electrical component(s), so that the electrode ( 6 ) totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) ( 3 ) in a conductive medium ( 17 ) consisting of the electrically charged particles. An electric field is created between the first electrode ( 6 ) and a second electrode ( 4 ) through the via-hole(s) ( 3 ) and the conductive medium ( 17 ) and the electrically charged particles are precipitated on the inner surface of the first electrode ( 6 ) that is directed to the second orifice of the via-hole(s) ( 3 ), until a desired portion of the volume of the via-hole(s) ( 3 ) is filled with a first layer of the charged particles having a desired thickness. More layers may be created by repeating this process using additional electophoretic cell(s), until remaining portion of the volume of the via-hole(s) ( 3 ) is filled with the additional charged particles. |
