| 发明名称 |
A CMP POLISHING PAD INCLUDING A SOLID CATALYST |
| 摘要 |
A polishing pad comprising a polishing pad substrate and at least one solid catalyst, the polishing pad being useful to remove metal layers from a substrate. |
| 申请公布号 |
EP1354012(A2) |
申请公布日期 |
2003.10.22 |
| 申请号 |
EP20020713421 |
申请日期 |
2002.01.16 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
MUELLER, BRIAN, L.;WANG, SHUMIN |
| 分类号 |
B24B37/00;B24B37/04;B24B37/24;B24D3/00;B24D3/02;B24D3/34;C09G1/02;C09K3/14;C23F3/00;H01L21/304;H01L21/321;(IPC1-7):C09G1/02 |
主分类号 |
B24B37/00 |
| 代理机构 |
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代理人 |
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