| 摘要 |
A semiconductor device of the MCM type capable of high-speed operation and low power consumption and its manufacturing method are provided. A plurality of semiconductor chips, each having an internal circuit as well as an external connection circuit drawn from the internal circuit, are mounted on the same supporting substrate of this semiconductor device. Semiconductor chips are connected with each other, not by way of the external connection circuits, but directly at a portion between the internal circuits through wiring. This wiring is patterned on an insulating film provided on the supporting substrate and covers the semiconductor chips. Accordingly, through connection holes formed on the insulating film, connection can be established to the internal circuits or the wiring can be formed on the supporting substrate side. If the wiring is formed on the supporting substrate side, the semiconductor chips are to be mounted facing down relative to the supporting substrate. |
