发明名称 |
Thin film capacitor and hybrid circuit board, and methods of producing same |
摘要 |
<p>A high-capacitance thin film capacitor is compact and has a low profile. A dielectric layer 3 is formed between opposed electrodes 1 and 2. Between the electrodes and the dielectric layer are two layers of conductive particles, 4 and 5. <IMAGE></p> |
申请公布号 |
EP0732713(B1) |
申请公布日期 |
2003.10.22 |
申请号 |
EP19960104179 |
申请日期 |
1996.03.15 |
申请人 |
OMRON CORPORATION |
发明人 |
KAWAI, WAKAHIRO |
分类号 |
H01G4/08;H01G4/33;H01L27/01;H05K1/14;H05K1/16;H05K3/10;H05K3/24;H05K3/38;(IPC1-7):H01G4/33;H01G4/008 |
主分类号 |
H01G4/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|