WAFER BACK-SIDE GRIND APPARATUS HAVING WAFER SENSOR

摘要

PURPOSE: A wafer back-side grind apparatus having a wafer sensor is provided to be capable of previously preventing an active surface of a wafer from being carried out with a back-side grinding process. CONSTITUTION: A wafer back-side grind apparatus(200) is provided with a wafer loading unit(210) for sequentially supplying wafers(10), a wafer transfer unit(250) for transferring the wafer, a wafer alignment unit(230), a wafer grind unit(240) for grinding the back-side of the wafer, a wafer unloading unit(260), and a control unit(270) electrically connected with the units for controlling the operation of each unit according to a control program. At this time, a light absorbing film is attached on the wafer as an active surface protecting film. The wafer back-side grind apparatus further includes a wafer sensor(235) installed at the upper portion of the wafer alignment unit for sensing the surface of the wafer and transmitting a signal corresponding to the detected surface to the control unit.