Heat-peelable pressure-sensitive adhesive sheet for electronic part, method of processing electronic part, and electronic part

摘要

A heat-peelable pressure-sensitive adhesive sheet for electronic parts which after a heat treatment can be easily peeled from the electronic parts while causing little contamination is disclosed. The heat-peelable pressure-sensitive adhesive sheet for electronic parts which has a heat-expandable layer containing heat-expandable microspheres and a non-heat-expandable pressure-sensitive adhesive layer formed on at least one side of the heat-expandable layer, wherein when the pressure-sensitive adhesive sheet is applied, on the side of the non-heat-expandable pressure-sensitive adhesive layer, to a surface of a silicon wafer and is thereafter heated and peeled from the wafer, then the carbon element proportion RC1 (%) on this silicon wafer surface satisfies at least either of the following relationships (1) and (2): RC1≤50+RC2 (1); RC1≤2.5RSi (2), wherein RC2 represents the carbon element proportion (%) on the silicon wafer surface before the application; and RSi represents the silicon element proportion (%) on the silicon wafer surface after the non-heat-expandable pressure-sensitive adhesive layer applied to the silicon wafer surface is heated and peeled therefrom.