发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
In the present semiconductor device, a chip with an LSI circuit is secured to a board 3 (with the chip flipped) so as to be level. The LSI circuit on the chip is specified to operate normally only when the chip is level. Further, the back of the chip is processed so as to give stress to the chip. The chip has a reduced thickness of 50 mu m or less (alternatively 30 mu m to 50 mu m). Therefore, when the chip is detached from the board, it deforms and is no longer level due to the stress, which prohibits the LSI circuit from operating normally. This way, the present semiconductor device ensures that no analysis can be conducted on the LSI circuit once the chip is detached. <IMAGE> |
申请公布号 |
EP1139424(A3) |
申请公布日期 |
2003.10.22 |
申请号 |
EP20010302597 |
申请日期 |
2001.03.21 |
申请人 |
SHARP KABUSHIKI KAISHA;NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
发明人 |
YANAGAWA, EIJI;NAKANO, AKIHIKO;OHMI, TOSHINORI;MATSUMOTO, HIRONORI;TAKEDA, TADAO;UNNO, HIDEYUKI;BAN, HIROSHI |
分类号 |
H01L21/02;H01L21/60;H01L21/822;H01L23/00;H01L23/12;H01L23/58;H01L27/04;H01L29/06 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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