| 摘要 |
A board with a plurality of device carrier areas thereon and an electrode pattern serving as external electrodes on a back of the board is prepared, and semiconductor chips are fixed respectively to the device carrier areas. The semiconductor chips fixed to the device carrier areas are covered with a common resin layer. A round surface of the common resin layer is flattened into a flat and horizontal surface, and a dicing sheet is applied to the flat and horizontal surface of the common resin layer with the electrode pattern facing upwardly. The board and the common resin layer are separated into segments including the device carrier areas thereby to produce individual semiconductor devices by dicing from the back of the board. <IMAGE> |
