WAFER CLEANING EQUIPMENT

摘要

PURPOSE: A wafer cleaning equipment is provided to be capable of preventing the damage of patterns formed at the upper portion of the wafer by using high frequency acoustic energy. CONSTITUTION: A wafer cleaning equipment is provided with a cleaning material supply part for forming a cleaning material layer(300) on the surface of a wafer(100), an energy condensing alleviation part(200) installed at one side of the wafer for prolonging the cleaning material layer to the outside of the wafer, a bar type probe(400) located across the energy condensing alleviation part parallel with the upper surface of the wafer for supplying high frequency acoustic vibration energy, a vibrator(500) connected to the rear portion of the probe for generating acoustic vibration. Preferably, the wafer cleaning equipment further includes a rotating shaft for rotating the wafer.