发明名称 Laser machining method for precision machining
摘要 A laser machining method and apparatus performs high-speed and high-precision machining on a thin film and a liquid crystal panel. The apparatus includes: a plurality of pulse laser generators, drivers for alternately driving a plurality of pulse laser generators to generate laser beams delayed in phase between each other; collimators for making the generated laser beams equal in quality; a wave plate for converting the laser beams into elliptically polarized laser beams; and a phase grating for dividing each laser beam emitted by each of the plurality of laser beam generators into a plurality of laser beams; such that an object to be processed is selectively illuminated with the plurality of laser beams produced by the phase grating. The phase grating has structure on its surface for dividing each of the laser beams into equal intensity beams. Open grooves are formed having uniform shape and quality.
申请公布号 US6635850(B2) 申请公布日期 2003.10.21
申请号 US20020047952 申请日期 2002.01.15
申请人 SEIKO EPSON CORPORATION 发明人 AMAKO JUN;MURAI MASAMI;OTA TSUTOMU;SONEHARA TOMIO
分类号 B23K26/06;B23K26/067;B23K26/40;G02F1/1343;(IPC1-7):B23K26/36 主分类号 B23K26/06
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