发明名称 Method of heat treatment
摘要 A thermal processing method of the invention includes; a loading step of loading an object to be processed into a processing container, the object having a surface provided with a silicon film having a minutely irregular profile; and a doping step of introducing phosphorus atoms in the silicon film as impurities, by using PH3 gas as a doping gas while maintaining a temperature of 550 to 750° C.
申请公布号 US6635310(B1) 申请公布日期 2003.10.21
申请号 US20010830334 申请日期 2001.04.26
申请人 TOKYO ELECTRON LIMITED 发明人 KATO HITOSHI;FUJITA YOSHIYUKI;TOJO YUKIO;TSUDA TOSHITAKE
分类号 H01L27/04;H01L21/02;H01L21/223;H01L21/3215;H01L21/822;H01L21/8242;(IPC1-7):C23C16/22 主分类号 H01L27/04
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