Serial connection structure of light emitting diode chip

摘要

A light emitting diode (LED) device includes a substrate having a major surface on which a number of LED chips are formed and arranged in a two-dimensional array. The LED chips have a p-type semiconductor and an n-type semiconductor. The n-type semiconductor of each LED chip is electrically connected to the p-type semiconductor of the adjacent LED chip, whereby the LED chips are connected in series. The p-type semiconductor of the starting LED chip and the n-type semiconductor of the ending LED chip are connected to conductors for electrical connection with an external power source. The arrangement of serially connected LED chips allows enhancement of the brightness of a single LED device when the size of the LED device is increased. The working voltage is also increased and the working current can be kept low. Interfacing equipment between the LED device and external power source can be simplified.