发明名称 |
Leadless plastic chip carrier with etch back pad singulation and die attach pad array |
摘要 |
A leadless plastic chip carrier has a plurality of die attach pads on which a singulated semi-conductor die is mounted. At least one row of contact pads circumscribes the plurality of die attach pads and a power/ground ring is intermediate the contact pads and the die attach pads. Wire bonds connect the semiconductor die, the contact pads and the power/ground ring. An overmold covers the semiconductor die, the die attach pads, the power/ground ring and the contact pads such that each of the die attach pads and the contact pads has one exposed surface.
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申请公布号 |
US6635957(B2) |
申请公布日期 |
2003.10.21 |
申请号 |
US20010802679 |
申请日期 |
2001.03.09 |
申请人 |
ASAT LTD. |
发明人 |
KWAN KIN PUI;LAU WING HIM;TSANG KWOK CHEUNG;FAN CHUN HO;MCLELLAN NEIL |
分类号 |
H01L21/48;H01L21/56;H01L21/68;H01L23/31;H01L23/495;(IPC1-7):H01L23/52;H01L23/28 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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