发明名称 Method and manufacturing MRAM offset cells in a damascene structure
摘要 A method of manufacturing an offset MRAM device (110), including utilizing two resist layers either to pattern a magnetic stack layer to form offset conductive lines (158) and magnetic memory cells (160), or to pattern an insulating layer to form vias (168) to expose magnetic memory cells and trenches (170) for conductive lines, or both, using a single etch process.
申请公布号 US6635546(B1) 申请公布日期 2003.10.21
申请号 US20020146976 申请日期 2002.05.16
申请人 INFINEON TECHNOLOGIES AG 发明人 NING X. J.
分类号 H01L21/3065;G11C11/15;H01L21/8246;H01L27/105;H01L43/08;(IPC1-7):H01L21/20 主分类号 H01L21/3065
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