发明名称 EPOXY RESIN COMPOSITION AND PREPREG
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which has storage stability for a long time, excellent handling property, a satisfactory curing rate at a predetermined temperature and suffices excellent mechanical strength, heat resistance of a cured product, and to provide a prepreg using the same. SOLUTION: The epoxy resin composition which comprizes (A) an epoxy resin, (B) a curing agent and (C) at least one compound selected from among imidazole derivatives and urea derivatives is characterized in that it contains 0.03-0.3 wt.% of hydrolyzable chlorine and has a glass transition temperature from -10 to 15°C. A prepreg containing the resin composition and a reinforcing fiber is also provided. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003301029(A) 申请公布日期 2003.10.21
申请号 JP20020107523 申请日期 2002.04.10
申请人 TORAY IND INC 发明人 OKITA HIDEKI;TOMIOKA NOBUYUKI;TAKAGISHI HIROYUKI
分类号 C08J5/24;C08G59/56;C08L63/00;C08L101/00;(IPC1-7):C08G59/56 主分类号 C08J5/24
代理机构 代理人
主权项
地址