| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition good in close adhesion with a non-treated plastic film base material, and suitable for making a cured coating film, a hard coat layer, excellent in scratch resisting property and pencil hardness. SOLUTION: The photosensitive resin composition containing a compound (A) having at least two ethylenic unsaturated groups in a molecule, an oligomer (B) which is obtained by reacting an epoxy resin (a) having at least two epoxy groups in a molecule and its epoxy equivalent is not smaller than 500 eq/g with a monocarboxylic acid (b) containing an ethylenic unsaturated group, a photopolymerization initiator (C), and an electroconductive metal oxide (D) having a primary particle diameter of 1-200 nm, is prepared, and by using a cured coating film thereof (a hard coat layer) having static electricity preventive property is provided on a plastic film base material. COPYRIGHT: (C)2004,JPO |
