发明名称 GRINDING PAD, GRINDING DEVICE, AND GRINDING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To facilitate removing a workpiece from a grinding pad surface after grinding, to decrease a grinding liquid used for grinding, and to reduce a manufacturing cost of a grinding pad. <P>SOLUTION: A first grinding pad 1 grinding the workpiece is provided with a plurality of long holes 11 penetrating the first grinding pad 1 in a thickness direction thereof. Preferably, the length in a longitudinal direction of the long holes 11 is formed to be not more than 20 mm, and the pitch in a width direction of the long holes 11 is made to be less than 100 mm. Small holes (not shown) may be provided in addition to the long holes 11. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003300149(A) 申请公布日期 2003.10.21
申请号 JP20020327853 申请日期 2002.11.12
申请人 SONY CORP 发明人 SHIBUKI SHUNICHI
分类号 B24B37/20;B24B37/26;H01L21/304 主分类号 B24B37/20
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